Electronic device

An electronic device includes a heat dissipation module, a first heat generating component thermally coupled to the heat dissipation module, a heat dissipation frame, a piezoelectric component and a heat conducting sheet. The heat dissipation frame is disposed on the heat dissipation module and incl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANG, SHUNI, TSAI, JUNG-SHIUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic device includes a heat dissipation module, a first heat generating component thermally coupled to the heat dissipation module, a heat dissipation frame, a piezoelectric component and a heat conducting sheet. The heat dissipation frame is disposed on the heat dissipation module and includes an air inlet and an air outlet. The heat dissipation frame defines a cavity that is in fluid communication with the air inlet and the air outlet. The piezoelectric component is disposed in the heat dissipation frame and corresponds to the air inlet. The piezoelectric component is configured to guide external air to flow into the air inlet and enter the cavity, and leave the cavity from the air outlet. The heat conducting sheet is thermally coupled to the heat dissipation frame and includes an extension portion for being thermally coupled to a second heat generating component.