Protection tape

A protection tape includes a substrate and an adhesive layer. The adhesive layer is located above the substrate and includes a main resin and polymer microspheres. The main resin has a softening temperature. The polymer microspheres are dispersed in the main resin. Each polymer microsphere has a hol...

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Bibliographische Detailangaben
Hauptverfasser:	LIN, CHIN-KAI, HUANG, CHI-HUA, CHEN, CHUN-FA, XIE, SHI-ROU, CHEN, XUAN-YOU, LEE, CHEN-JU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A protection tape includes a substrate and an adhesive layer. The adhesive layer is located above the substrate and includes a main resin and polymer microspheres. The main resin has a softening temperature. The polymer microspheres are dispersed in the main resin. Each polymer microsphere has a hollow structure.