Immersion-cooled heat-dissipation structure

Immersion-cooled heat-dissipation structure

An immersion-cooled heat-dissipation structure includes a porous metal heat dissipation material having a porosity that is greater than 8%, an integrated heat spreader, and a thermal interface material. The thermal interface material is located between the porous metal heat dissipation material and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YE, ZI-YANG, PENG, CHENG-SHU, YANG, JING-MING
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BLASTING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
WEAPONS
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Beschreibung
Zusammenfassung:An immersion-cooled heat-dissipation structure includes a porous metal heat dissipation material having a porosity that is greater than 8%, an integrated heat spreader, and a thermal interface material. The thermal interface material is located between the porous metal heat dissipation material and the integrated heat spreader to form a thermal connection there-between. A super-wetting layer is formed on a connecting surface between the porous metal heat dissipation material and the thermal interface material, and the water wetting angle of the super-wetting layer is less than 10DEG, or a super-hydrophobic layer is formed on a connecting surface between the porous metal heat dissipation material and the thermal interface material, and the water wetting angle of the super-hydrophobic layer is greater than 120DEG.