Heat dissipation device

Heat dissipation device

A heat dissipation device includes a plurality of fins, a base and at least one first fan. The plurality of fins form a plurality of heat conduction channels. The plurality of heat conduction channels are used to conduct heat to the plurality of fins. One end of the base is connected with a pluralit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG, PINN, CHEN, CHEN-AN, LUO, KUN-LUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A heat dissipation device includes a plurality of fins, a base and at least one first fan. The plurality of fins form a plurality of heat conduction channels. The plurality of heat conduction channels are used to conduct heat to the plurality of fins. One end of the base is connected with a plurality of electronic components, and the other end of the base is connected with the plurality of fins. The at least one first fan is disposed above the plurality of fins. The at least one first fan is used for blowing cold air in from one end of the plurality of heat conduction channels and along the plurality of heat conduction channels to take away the heat conducted to the plurality of fins and blow it out from the other end of the plurality of heat conduction channels.