Heat-dissipating substrate structure with high adhesion strength
A heat-dissipating substrate structure with high adhesion strength includes a heat dissipation layer, a function layer, and a matching layer. The function layer is formed by sputtering and has at least one of a corrosion-resistant property, a soldering ability, and a sintering ability. The function...
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| Zusammenfassung: | A heat-dissipating substrate structure with high adhesion strength includes a heat dissipation layer, a function layer, and a matching layer. The function layer is formed by sputtering and has at least one of a corrosion-resistant property, a soldering ability, and a sintering ability. The function layer has one or more layers, and the thickness of each layer is set to be less than 3 um. The matching layer has one or more layers, and the thickness of each layer is set to be less than 1 um. The matching layer is formed by sputtering at least one of titanium, titanium alloy, nickel, and nickel alloy, and the matching layer is formed between the function layer and the heat dissipation layer, so as to increase the adhesion strength between the function layer and the heat dissipation layer. |
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