Plating device

The present disclosure provides a highly versatile plating apparatus capable of being applied to either electrolytic plating or electroless plating and is suitable for a long workpiece. The present disclosure includes a horizontal transport unit performing plating pretreatment while horizontally transporting a long workpiece unwound by a unwinding unit; a workpiece-form changing unit changing the form of a long workpiece sent out from the horizontal transport unit from horizontal state to vertical state; a vertical transport unit having an endless chain transport mechanism and a plating tank, the endless chain transport mechanism provided with a plurality of transport clips for gripping the upper end of a long workpiece in a vertical state, and the plating tank is used for performing a plating process on a long workpiece in a vertical state; and a winding unit winding and collecting the plating treated long workpiece sent from the vertical transport unit.