Package structure

Package structure

A package structure includes a carrier substrate, a first chip, a plurality of conductive pillars, an insulation encapsulation, and a second chip. The carrier substrate has a first surface and a second surface opposite to the first surface. The first chip is disposed on the first surface. The conduc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHANG, CHIA-WEI, CHUANG, YONGNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package structure includes a carrier substrate, a first chip, a plurality of conductive pillars, an insulation encapsulation, and a second chip. The carrier substrate has a first surface and a second surface opposite to the first surface. The first chip is disposed on the first surface. The conductive pillars are disposed on the first surface and surround the first chip. The insulation encapsulation encapsulates the first chip and the conductive pillars. The insulation encapsulation exposes top surfaces of the conductive pillars. The second chip is disposed on the second surface.