Electrochemical plating apparatus and wafer edge detecting system

An electrochemical plating apparatus including a plating and removing metal form wafer edge module, a carrying platform, a robot arm and detecting device. The plating and removing metal form wafer edge module is used wafer plating process and wafer edge metal removal process. The robot arm grabs the wafer and makes the wafer moving at between the plating and removing metal form wafer edge module and the carrying platform. The detecting device is disposed on the carrying platform for detecting edge of the wafer. The detecting device includes an image capturing unit, a first light source and a second light source. The image capturing unit is located above the wafer for capturing an image of edge of the wafer. An angle is disposed between an optical axis of the image capturing unit and a top surface of the wafer and the angle between 30 degrees to 90 degrees. The first source is located above the wafer and a light emitting face of the first light source faces to edge of the wafer. The second source is located be