Polishing pad

The invention discloses a polishing pad. The polishing pad of the invention includes a polishing layer, a supporting layer and an adhesion layer. The polishing layer is formed of polyurethane, and has a plurality of grooves which are formed substantially into a plurality of concentric circles on a p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, WEN-HUA, WENG, WEN-PING, TSENG, HUANUAN, SU, HSIAO-PING, YEN, KUANIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention discloses a polishing pad. The polishing pad of the invention includes a polishing layer, a supporting layer and an adhesion layer. The polishing layer is formed of polyurethane, and has a plurality of grooves which are formed substantially into a plurality of concentric circles on a polishing surface of the polishing layer. The supporting layer is formed of polyurethane, and has a circular recess formed at a center thereof. The adhesion layer is laminated between a bottom surface of the polishing layer and a top surface of the supporting layer.