Atom trapping chips with double layer of metal wire patterns and the heat dissipation device

This invention relates to the atom trapping chips with double layer of metal wire patterns and the heat dissipation device. The characteristic of the device is to use the heat dissipation electroplated copper blocks located in the lower layer of the atom trapping chips. The purpose of this copper bl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUANG, HOIAO, WENG, CHUNG-WEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	GAMMA RAY OR X-RAY MICROSCOPES IRRADIATION DEVICES NUCLEAR ENGINEERING NUCLEAR PHYSICS PHYSICS TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR
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