Method for forming t display module

The invention discloses a display module and a manufacturing method thereof. The display module comprises a light-emitting element, a packaging layer, a metal contact, an insulating layer and an array substrate. The light-emitting element has a first surface and a second surface opposite to each oth...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LAI, HANUNG, TSAI, RONG-SHENG, LI, WEN-JEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a display module and a manufacturing method thereof. The display module comprises a light-emitting element, a packaging layer, a metal contact, an insulating layer and an array substrate. The light-emitting element has a first surface and a second surface opposite to each other. The light-emitting element is further provided with a pin located on the first surface. The encapsulation layer laterally surrounds the light-emitting element and has a first surface and a second surface opposite to each other. The first surface of the encapsulation layer is adjacent to the first surface of the light-emitting element. The first surface of the packaging layer is a rough surface. The metal contact covers the pins of the light-emitting element. The insulating layer covers the metal contact and the encapsulation layer. The array substrate is located on the insulating layer and is provided with a connecting pad. The pad is configured to be electrically connected to the metal contact.