Resin molding apparatus and resin molded product manufacturing method

The present invention provides a resin molding device which clamps a plurality of molding dies, molds resin by absorbing variations in the thicknesses of molding objects in the molding dies while synchronizing the clamping of the plurality of molding dies, and comprises a lift interlocking mechanism...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YASUI, HAYATO, NAKAO, SATOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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