Resin molding apparatus and resin molded product manufacturing method

The present invention provides a resin molding device which clamps a plurality of molding dies, molds resin by absorbing variations in the thicknesses of molding objects in the molding dies while synchronizing the clamping of the plurality of molding dies, and comprises a lift interlocking mechanism 8 that interlocks the raising/lowering of an intermediate plate 4 with the raising/lowering of a movable platen 3. The lift interlocking mechanism 8 comprises a pantograph mechanism 81 that expands and contracts due to the raising/lowering of the movable platen 3, and a coupling mechanism 82 that couples a crossing link portion 811 of the pantograph mechanism 81 with the intermediate plate 4. The coupling mechanism 82 includes a connection member 821 connected to the crossing link portion 811, a coupling member 822 that couples the connection member 821 with the intermediate plate 4, and elastic members 823a, 823b interposed between the connection member 821 and the coupling member 822.