SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THE SAME

The present invention provides a semiconductor wafer and a method of manufacturing the same. Said semiconductor wafer comprises: a substrate, the material of which is silicon carbide; a channel layer, which is configured above the substrate; a lattice matching layer, which is configured between the...

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Bibliographische Detailangaben
1. Verfasser:	WU, CHAN-SHIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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