Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing
Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where...
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| creator | JING, JIANFEN NI, MASON YANG, VIOLA ZHOU, JAIME MA, JEREMY LI, HENG YAO, YING HUANG, YUERUI WANG, GUOHAO |
| description | Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where x is 5-20, y is 5-20, and the alkyl is a linear or branched chain having 11-15 carbon atoms. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI855208BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI855208BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI855208BB3</originalsourceid><addsrcrecordid>eNqNjDEKAkEMALexEPUP-YAgysHVdyjaH1ieIUY3sJcNm7Xw94pYi9VMMcw8XPrIkxAmmJgi6kctJ_EoegdPj1KegHoFqQ5olt5FlawgCpTNuAD9WizD7IbJefXlIsBhP_THNVse2Q2Jles4nE9t02w3bdft_khej-Q94Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing</title><source>esp@cenet</source><creator>JING, JIANFEN ; NI, MASON ; YANG, VIOLA ; ZHOU, JAIME ; MA, JEREMY ; LI, HENG ; YAO, YING ; HUANG, YUERUI ; WANG, GUOHAO</creator><creatorcontrib>JING, JIANFEN ; NI, MASON ; YANG, VIOLA ; ZHOU, JAIME ; MA, JEREMY ; LI, HENG ; YAO, YING ; HUANG, YUERUI ; WANG, GUOHAO</creatorcontrib><description>Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where x is 5-20, y is 5-20, and the alkyl is a linear or branched chain having 11-15 carbon atoms.</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POLISHING ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SEMICONDUCTOR DEVICES ; SKI WAXES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240911&DB=EPODOC&CC=TW&NR=I855208B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240911&DB=EPODOC&CC=TW&NR=I855208B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JING, JIANFEN</creatorcontrib><creatorcontrib>NI, MASON</creatorcontrib><creatorcontrib>YANG, VIOLA</creatorcontrib><creatorcontrib>ZHOU, JAIME</creatorcontrib><creatorcontrib>MA, JEREMY</creatorcontrib><creatorcontrib>LI, HENG</creatorcontrib><creatorcontrib>YAO, YING</creatorcontrib><creatorcontrib>HUANG, YUERUI</creatorcontrib><creatorcontrib>WANG, GUOHAO</creatorcontrib><title>Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing</title><description>Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where x is 5-20, y is 5-20, and the alkyl is a linear or branched chain having 11-15 carbon atoms.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SKI WAXES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKAkEMALexEPUP-YAgysHVdyjaH1ieIUY3sJcNm7Xw94pYi9VMMcw8XPrIkxAmmJgi6kctJ_EoegdPj1KegHoFqQ5olt5FlawgCpTNuAD9WizD7IbJefXlIsBhP_THNVse2Q2Jles4nE9t02w3bdft_khej-Q94Q</recordid><startdate>20240911</startdate><enddate>20240911</enddate><creator>JING, JIANFEN</creator><creator>NI, MASON</creator><creator>YANG, VIOLA</creator><creator>ZHOU, JAIME</creator><creator>MA, JEREMY</creator><creator>LI, HENG</creator><creator>YAO, YING</creator><creator>HUANG, YUERUI</creator><creator>WANG, GUOHAO</creator><scope>EVB</scope></search><sort><creationdate>20240911</creationdate><title>Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing</title><author>JING, JIANFEN ; NI, MASON ; YANG, VIOLA ; ZHOU, JAIME ; MA, JEREMY ; LI, HENG ; YAO, YING ; HUANG, YUERUI ; WANG, GUOHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI855208BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POLISHING</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SKI WAXES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JING, JIANFEN</creatorcontrib><creatorcontrib>NI, MASON</creatorcontrib><creatorcontrib>YANG, VIOLA</creatorcontrib><creatorcontrib>ZHOU, JAIME</creatorcontrib><creatorcontrib>MA, JEREMY</creatorcontrib><creatorcontrib>LI, HENG</creatorcontrib><creatorcontrib>YAO, YING</creatorcontrib><creatorcontrib>HUANG, YUERUI</creatorcontrib><creatorcontrib>WANG, GUOHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JING, JIANFEN</au><au>NI, MASON</au><au>YANG, VIOLA</au><au>ZHOU, JAIME</au><au>MA, JEREMY</au><au>LI, HENG</au><au>YAO, YING</au><au>HUANG, YUERUI</au><au>WANG, GUOHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing</title><date>2024-09-11</date><risdate>2024</risdate><abstract>Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where x is 5-20, y is 5-20, and the alkyl is a linear or branched chain having 11-15 carbon atoms.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING |
| title | Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing |
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