Chemical mechanical polishing slurry and its application in copper chemical mechanical polishing

Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where...

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Bibliographische Detailangaben
Hauptverfasser:	JING, JIANFEN, NI, MASON, YANG, VIOLA, ZHOU, JAIME, MA, JEREMY, LI, HENG, YAO, YING, HUANG, YUERUI, WANG, GUOHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed are a chemical-mechanical polishing liquid and the use thereof in copper polishing. The chemical-mechanical polishing liquid comprises a non-ionic surfactant, abrasive particles and an oxidizing agent, wherein the non-ionic surfactant is an (ethoxylated)x(butoxylated)y alkyl alcohol, where x is 5-20, y is 5-20, and the alkyl is a linear or branched chain having 11-15 carbon atoms.