TWI855143B

The present invention addresses the problem of providing: a phenolic resin which has excellent flowability and gives cured objects having an excellent balance among high-temperature modulus, low hygroscopicity, and dielectric properties and which is suitable for use in semiconductor-encapsulating ma...

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Bibliographische Detailangaben
1. Verfasser:	HIROTA, YOUSUKE
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing: a phenolic resin which has excellent flowability and gives cured objects having an excellent balance among high-temperature modulus, low hygroscopicity, and dielectric properties and which is suitable for use in semiconductor-encapsulating materials, etc.; a composition; and a cured object obtained from the composition. The phenolic resin is characterized by being a product of reaction between a monophenol compound and a hydroxylated aromatic carboxylic acid and in that in GPC analysis, the total area of peaks assignable to an ester compound represented by formula (1) and a ketone compound (2) represented by formula (2) accounts for 70-99%. (In the formulae, R1 to R17 are each independently a hydrogen atom, an alkyl group having 1-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms.)