TWI855105B

[Solution] A resin sheet for sealing according to the present invention contains a thermosetting resin, and is used for the purpose of sealing an element. This resin sheet for sealing additionally contains a layered silicate compound.

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Bibliographische Detailangaben
Hauptverfasser:	HABU, TAKASHI, IINO, CHIE, OHARA, YASUMICHI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	[Solution] A resin sheet for sealing according to the present invention contains a thermosetting resin, and is used for the purpose of sealing an element. This resin sheet for sealing additionally contains a layered silicate compound.