Polyamic acid composition and polyimide prepared therefrom

The present invention relates to a polyamic acid composition and a polyimide including same and exhibits excellent thermal properties such as dimensional stability and heat resistance while retaining high transparency.

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Bibliographische Detailangaben
Hauptverfasser:	HWANG, IN HWAN, PARK, SE JOO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polyamic acid composition and a polyimide including same and exhibits excellent thermal properties such as dimensional stability and heat resistance while retaining high transparency.