Photosensitive resin composition, photoresist comprising same, display device comprising same, and method of low-temperature curing photosensitive resin composition

The present invention relates to a photosensitive resin composition, a photosensitive material, a display device, and a low-temperature curing method of the photosensitive resin composition. The photosensitive resin composition according to an exemplary embodiment of the present invention has excell...

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Bibliographische Detailangaben
Hauptverfasser:	NOH, BYEONG IL, JUNG, HYUNJIN, LEE, YOUNGHEE, KIM, DAE HYUN, LEE, SOOHEE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CALCULATING CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition, a photosensitive material, a display device, and a low-temperature curing method of the photosensitive resin composition. The photosensitive resin composition according to an exemplary embodiment of the present invention has excellent solvent solubility, excellent heat resistance and chemical resistance, and excellent pattern characteristics when forming an organic film.