Substrate and simecondutor device

A board-level pad pattern includes a printed circuit board, PCB, substrate; an exposed pad region (30) disposed within a surface mount region (10) of the base substrate; and multiple staggered ball pads disposed within the surface mount region (10) arranged in a ring shape around the exposed pad reg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANG, HUII, HO, SHAOUN, LIN, HSUAN-YI, HUANG, PU-SHAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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