Substrate and simecondutor device

A board-level pad pattern includes a printed circuit board, PCB, substrate; an exposed pad region (30) disposed within a surface mount region (10) of the base substrate; and multiple staggered ball pads disposed within the surface mount region (10) arranged in a ring shape around the exposed pad reg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANG, HUII, HO, SHAOUN, LIN, HSUAN-YI, HUANG, PU-SHAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A board-level pad pattern includes a printed circuit board, PCB, substrate; an exposed pad region (30) disposed within a surface mount region (10) of the base substrate; and multiple staggered ball pads disposed within the surface mount region (10) arranged in a ring shape around the exposed pad region (30). The staggered ball pads includes first ball pads arranged in a first row (R1) and second ball pads arranged in a second row (R2). The first ball pads in the first row (R1) are arranged at two different pitches, and the second ball pads in the second row (R2) are arranged at a constant pitch. Multiple square-shaped ball pads (301-304) are arranged in a third row (R3) between the exposed pad region (30) and the staggered ball pads.