Photosensitive resin composition, photosensitive resin layer using the same, filter and display device

A photosensitive resin composition, a photosensitive resin layer, a color filter, and a display device, the photosensitive resin composition includes a photopolymerizable compound; a photopolymerization initiator; a colorant; a binder resin; and a solvent, wherein the solvent includes a first solven...

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Bibliographische Detailangaben
Hauptverfasser:	SONG, HAENI, KIM, JIHYE, KIM, SABINA, KIM, JIHONG, PARK, BAEK SOUNG, YOO, JEONGHO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DYES ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY LAKES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MORDANTS NATURAL RESINS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICAL LOGIC ELEMENTS OPTICS ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A photosensitive resin composition, a photosensitive resin layer, a color filter, and a display device, the photosensitive resin composition includes a photopolymerizable compound; a photopolymerization initiator; a colorant; a binder resin; and a solvent, wherein the solvent includes a first solvent and a second solvent, the first solvent has a boiling point of greater than about 0° C. and less than about 150° C. at 1 atm, the second solvent has a boiling point of greater than or equal to about 150° C. at 1 atm, and the first solvent is included in the photosensitive resin composition in an amount greater than that of the second solvent.