Composition for plating copper and method of forming conductors including copper using the same

Provided are a composition for copper plating and a manufacturing method of a copper-containing conductor using the same. According to embodiments of the present invention, the composition for the copper plating comprises: a copper salt; an acidic compound or a salt thereof; a chlorine ion source; a...

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Bibliographische Detailangaben
Hauptverfasser:	KWON, O BYOUNG, LEE, DONG RYUL, LEE, SUCK JUN, HEO, JI EUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided are a composition for copper plating and a manufacturing method of a copper-containing conductor using the same. According to embodiments of the present invention, the composition for the copper plating comprises: a copper salt; an acidic compound or a salt thereof; a chlorine ion source; and a leveling agent represented by a specific chemical formula 1. Through an electrolytic plating process using the composition for the copper plating, a copper plating film with low surface roughness, excellent surface flatness, and thickness uniformity can be formed.