TWI853124B

Provided are: a curable resin composition comprising a resin having at least one repeating unit selected from the group consisting of repeating units represented by formula (1-1) and repeating units represented by formula (1-2) and a polymerization initiator; a cured film obtained by curing the cura...

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1. Verfasser: NOZAKI, ATSUYASU
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:Provided are: a curable resin composition comprising a resin having at least one repeating unit selected from the group consisting of repeating units represented by formula (1-1) and repeating units represented by formula (1-2) and a polymerization initiator; a cured film obtained by curing the curable resin composition; a layered product including the cured film; a method for producing the cured film; and a semiconductor device including the cured film or the layered product. Also provided is a novel resin having a specific structure.