TWI852926B

The present invention provides a metal-clad laminate having suppressed generation of foaming due to heat treatment at a high temperature. In the metal-clad laminate having a metal layer laminated on a flat surface or both surfaces of an insulating resin layer, polyimide forming a main polyimide laye...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAISHI, KATSUFUMI, ANDO, TOMONORI, YAMADA, HIROAKI, KITTAKA, NAOKI, NISHIYAMA, TEPPEI
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a metal-clad laminate having suppressed generation of foaming due to heat treatment at a high temperature. In the metal-clad laminate having a metal layer laminated on a flat surface or both surfaces of an insulating resin layer, polyimide forming a main polyimide layer (A) comprises a diamine residue derived from an aromatic diamine compound containing a fluorine atom and/or an acid anhydride residue derived from an aromatic tetracarboxylic anhydride containing a fluorine atom. A polyimide layer (B) coming in contact with the metal layer has storage elasticity that is more than 1 × 10^8 Pa at 350°C, and further, is formed with polyimide of which a glass transition temperature is more than 280°C.