TWI851869B
A method of manufacturing a bonded body includes a preparation step of interposing a sealing material containing glass between a highly thermal conductive substrate and a glass substrate, and a bonding step of forming a sealing layer by irradiating the sealing material with laser light. The bonding...
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| creator | SHIRAGAMI, TORU |
| description | A method of manufacturing a bonded body includes a preparation step of interposing a sealing material containing glass between a highly thermal conductive substrate and a glass substrate, and a bonding step of forming a sealing layer by irradiating the sealing material with laser light. The bonding step includes a first heating step of preheating the sealing material at a temperature lower than a softening point of the sealing material or a temperature at which the sealing material is prevented from softening and flowing by irradiation with the laser light, and a second heating step of heating, after the first heating step, the sealing material at a temperature equal to or higher than the softening point of the sealing material or a temperature at which the sealing material softens and flows by irradiation with the laser light. |
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The bonding step includes a first heating step of preheating the sealing material at a temperature lower than a softening point of the sealing material or a temperature at which the sealing material is prevented from softening and flowing by irradiation with the laser light, and a second heating step of heating, after the first heating step, the sealing material at a temperature equal to or higher than the softening point of the sealing material or a temperature at which the sealing material softens and flows by irradiation with the laser light.</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240811&DB=EPODOC&CC=TW&NR=I851869B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240811&DB=EPODOC&CC=TW&NR=I851869B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRAGAMI, TORU</creatorcontrib><title>TWI851869B</title><description>A method of manufacturing a bonded body includes a preparation step of interposing a sealing material containing glass between a highly thermal conductive substrate and a glass substrate, and a bonding step of forming a sealing layer by irradiating the sealing material with laser light. The bonding step includes a first heating step of preheating the sealing material at a temperature lower than a softening point of the sealing material or a temperature at which the sealing material is prevented from softening and flowing by irradiation with the laser light, and a second heating step of heating, after the first heating step, the sealing material at a temperature equal to or higher than the softening point of the sealing material or a temperature at which the sealing material softens and flows by irradiation with the laser light.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDW0MLN04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAD-sboA</recordid><startdate>20240811</startdate><enddate>20240811</enddate><creator>SHIRAGAMI, TORU</creator><scope>EVB</scope></search><sort><creationdate>20240811</creationdate><title>TWI851869B</title><author>SHIRAGAMI, TORU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI851869BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRAGAMI, TORU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRAGAMI, TORU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI851869B</title><date>2024-08-11</date><risdate>2024</risdate><abstract>A method of manufacturing a bonded body includes a preparation step of interposing a sealing material containing glass between a highly thermal conductive substrate and a glass substrate, and a bonding step of forming a sealing layer by irradiating the sealing material with laser light. The bonding step includes a first heating step of preheating the sealing material at a temperature lower than a softening point of the sealing material or a temperature at which the sealing material is prevented from softening and flowing by irradiation with the laser light, and a second heating step of heating, after the first heating step, the sealing material at a temperature equal to or higher than the softening point of the sealing material or a temperature at which the sealing material softens and flows by irradiation with the laser light.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | TWI851869B |
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