TWI851680B

An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive layer 14 disposed on the first adhesive layer 13. The thickness of...

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Bibliographische Detailangaben
Hauptverfasser:	OTO, YUMIKO, KUDO, SUNAO, ITO, AKIHIRO
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive layer 14 disposed on the first adhesive layer 13. The thickness of the first adhesive layer is 0.1 to 1.0-times the average particle diameter of the conductive particles.