Single-sided polishing methof for wafer, method for manufacturing wafer, and single-sided polishing device for wafer

To provide a wafer one-side polishing method that can obtain a wafer in a desired shape.SOLUTION: A wafer one-side polishing method, which uses a one-side polishing device that polishes a wafer by rotating a polishing head and a suede-type polishing pad which is larger than the wafer while pressing...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUGIMORI, KATSUHISA, ARAKI, TAKUYA, OKUBO, SHOHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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