Single-sided polishing methof for wafer, method for manufacturing wafer, and single-sided polishing device for wafer

To provide a wafer one-side polishing method that can obtain a wafer in a desired shape.SOLUTION: A wafer one-side polishing method, which uses a one-side polishing device that polishes a wafer by rotating a polishing head and a suede-type polishing pad which is larger than the wafer while pressing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMORI, KATSUHISA, ARAKI, TAKUYA, OKUBO, SHOHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a wafer one-side polishing method that can obtain a wafer in a desired shape.SOLUTION: A wafer one-side polishing method, which uses a one-side polishing device that polishes a wafer by rotating a polishing head and a suede-type polishing pad which is larger than the wafer while pressing the wafer held by the polishing head against the polishing pad, comprises: a compressibility-distribution calculating step of determining a compressibility distribution in a radial direction of the polishing pad in accordance with a target shape of the polished wafer; a polishing pad adjusting step of adjusting the polishing pad so that the pad has the compressibility distribution; and a polishing step of polishing the wafer using the polishing pad having the compressibility distribution.SELECTED DRAWING: Figure 5