TWI850008B

TWI850008B

To provide an electronic component processing device that positions and orients an electronic component in predetermined positions and orientations relative to processing units.SOLUTION: An electronic component processing device 10 comprises: an ejector mechanism that ejects, in the J direction, an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: UEDA, RYOJI, MINAMI, HIDEO
Format: Patent
Sprache:chi
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator UEDA, RYOJI
MINAMI, HIDEO
description To provide an electronic component processing device that positions and orients an electronic component in predetermined positions and orientations relative to processing units.SOLUTION: An electronic component processing device 10 comprises: an ejector mechanism that ejects, in the J direction, an electronic component W attached to a wafer sheet; a pick-up unit 13 having a component support part 12 that acquires, in a pick-up position P1, the electronic component W ejected in the J direction; a transfer unit that moves, by rotation of a rotating body 15 to which a component holding unit 14 to acquire the electronic component W from the pick-up unit 13 in an acquisition position P2 is attached, the component holding part 14 to processing positions P7-P11; and processing units 17-21 that perform prescribed processing on the electronic component W arranged in the processing positions P7-P11. The device comprises: a first drive mechanism to move the ejector mechanism parallel to the wafer sheet; a second drive m
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI850008BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI850008BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI850008BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MDUwMLBw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAB3AbcA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI850008B</title><source>esp@cenet</source><creator>UEDA, RYOJI ; MINAMI, HIDEO</creator><creatorcontrib>UEDA, RYOJI ; MINAMI, HIDEO</creatorcontrib><description>To provide an electronic component processing device that positions and orients an electronic component in predetermined positions and orientations relative to processing units.SOLUTION: An electronic component processing device 10 comprises: an ejector mechanism that ejects, in the J direction, an electronic component W attached to a wafer sheet; a pick-up unit 13 having a component support part 12 that acquires, in a pick-up position P1, the electronic component W ejected in the J direction; a transfer unit that moves, by rotation of a rotating body 15 to which a component holding unit 14 to acquire the electronic component W from the pick-up unit 13 in an acquisition position P2 is attached, the component holding part 14 to processing positions P7-P11; and processing units 17-21 that perform prescribed processing on the electronic component W arranged in the processing positions P7-P11. The device comprises: a first drive mechanism to move the ejector mechanism parallel to the wafer sheet; a second drive m</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240721&amp;DB=EPODOC&amp;CC=TW&amp;NR=I850008B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240721&amp;DB=EPODOC&amp;CC=TW&amp;NR=I850008B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEDA, RYOJI</creatorcontrib><creatorcontrib>MINAMI, HIDEO</creatorcontrib><title>TWI850008B</title><description>To provide an electronic component processing device that positions and orients an electronic component in predetermined positions and orientations relative to processing units.SOLUTION: An electronic component processing device 10 comprises: an ejector mechanism that ejects, in the J direction, an electronic component W attached to a wafer sheet; a pick-up unit 13 having a component support part 12 that acquires, in a pick-up position P1, the electronic component W ejected in the J direction; a transfer unit that moves, by rotation of a rotating body 15 to which a component holding unit 14 to acquire the electronic component W from the pick-up unit 13 in an acquisition position P2 is attached, the component holding part 14 to processing positions P7-P11; and processing units 17-21 that perform prescribed processing on the electronic component W arranged in the processing positions P7-P11. The device comprises: a first drive mechanism to move the ejector mechanism parallel to the wafer sheet; a second drive m</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDUwMLBw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAB3AbcA</recordid><startdate>20240721</startdate><enddate>20240721</enddate><creator>UEDA, RYOJI</creator><creator>MINAMI, HIDEO</creator><scope>EVB</scope></search><sort><creationdate>20240721</creationdate><title>TWI850008B</title><author>UEDA, RYOJI ; MINAMI, HIDEO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI850008BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>UEDA, RYOJI</creatorcontrib><creatorcontrib>MINAMI, HIDEO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEDA, RYOJI</au><au>MINAMI, HIDEO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI850008B</title><date>2024-07-21</date><risdate>2024</risdate><abstract>To provide an electronic component processing device that positions and orients an electronic component in predetermined positions and orientations relative to processing units.SOLUTION: An electronic component processing device 10 comprises: an ejector mechanism that ejects, in the J direction, an electronic component W attached to a wafer sheet; a pick-up unit 13 having a component support part 12 that acquires, in a pick-up position P1, the electronic component W ejected in the J direction; a transfer unit that moves, by rotation of a rotating body 15 to which a component holding unit 14 to acquire the electronic component W from the pick-up unit 13 in an acquisition position P2 is attached, the component holding part 14 to processing positions P7-P11; and processing units 17-21 that perform prescribed processing on the electronic component W arranged in the processing positions P7-P11. The device comprises: a first drive mechanism to move the ejector mechanism parallel to the wafer sheet; a second drive m</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi
recordid cdi_epo_espacenet_TWI850008BB
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title TWI850008B
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T14%3A44%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UEDA,%20RYOJI&rft.date=2024-07-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI850008BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true