TWI850008B

To provide an electronic component processing device that positions and orients an electronic component in predetermined positions and orientations relative to processing units.SOLUTION: An electronic component processing device 10 comprises: an ejector mechanism that ejects, in the J direction, an electronic component W attached to a wafer sheet; a pick-up unit 13 having a component support part 12 that acquires, in a pick-up position P1, the electronic component W ejected in the J direction; a transfer unit that moves, by rotation of a rotating body 15 to which a component holding unit 14 to acquire the electronic component W from the pick-up unit 13 in an acquisition position P2 is attached, the component holding part 14 to processing positions P7-P11; and processing units 17-21 that perform prescribed processing on the electronic component W arranged in the processing positions P7-P11. The device comprises: a first drive mechanism to move the ejector mechanism parallel to the wafer sheet; a second drive m