Resin composition for mold cleaning

Provided is a resin composition for die cleaning including a melamine resin, a filler, an acidic compound, and at least one compound selected from the group consisting of an imide compound having a molecular weight of 500 or less and a urea compound having a molecular weight of 500 or less. The acid...

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Bibliographische Detailangaben
Hauptverfasser:	IWATA, JUN, YOSHIMURA, KATSUNORI, FUKUNISHI, YOUICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided is a resin composition for die cleaning including a melamine resin, a filler, an acidic compound, and at least one compound selected from the group consisting of an imide compound having a molecular weight of 500 or less and a urea compound having a molecular weight of 500 or less. The acidic compound is a different compound from the imide compound, and the ratio of the total mass content of the imide compound and the urea compound to the mass content of the acidic compound is in the range of 0.01-100.0.