Encapsulated component and method for the production thereof
The invention relates to a covered component (10) having a thermally conductive element (20) and a thermally conductive covering material (30) which is filled into an inner region of the element (20). The element (20) has multiple openings (21) which connect the inner region to an outer region of th...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to a covered component (10) having a thermally conductive element (20) and a thermally conductive covering material (30) which is filled into an inner region of the element (20). The element (20) has multiple openings (21) which connect the inner region to an outer region of the element (20), wherein the covering material (30) fills the openings (21). The invention additionally relates to a method for producing the covered component (10) in that an inner region of a thermally conductive element (20) which has multiple openings (21) is filled with a covering material (30) such that the material enters the openings (21). |
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