Thermoplastic resin composition and molded article formed by molding the same

This thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that: the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, where the primary component of the aromatic dicarboxylic...

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Hauptverfasser: SAIJO, TAKEHITO, MII, JUNICHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:This thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that: the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, where the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290˚C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30˚C.