TWI848891B

Provided is a plating apparatus to determine appropriate control parameters for forming plating with high film thickness flatness on a substrate. The plating apparatus includes an estimation unit that estimates a density of a current flowing through an outer edge of the substrate, a current density calculation unit that calculates a density of a plating current flowing through a plating solution into the substrate based on the estimated current density, and a control parameter that specifies an operation mode of the plating apparatus, the current density calculation unit calculating the plating current density for each of a plurality of different operation modes of the plating apparatus, a film thickness calculation unit that calculates a thickness of a plating film formed on the substrate for each of the plurality of operation modes, based on each calculated plating current density, and a control parameter determination unit that determines a control parameter corresponding to an optimal operation mode, base