TWI847801B

[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Solution] A curable resin composition that enables alkaline de...

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Bibliographische Detailangaben
Hauptverfasser:	ODAGIRI, YUTO, YOKOYAMA, YUTAKA, KOIKE, NAOYUKI, YONEDA, KAZUYOSHI, MIYABE, HIDEKAZU
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Solution] A curable resin composition that enables alkaline development and forms a cured film when subjected to exposure and heat treatment. If a dried coating film having a thickness of 2-100 μm is formed from this curable resin composition, the arithmetic mean roughness Ra of the dried coating film is less than 0.1 μm, and the arithmetic mean roughness Ra of a cured film obtained by heat curing the dried coating film is 0.1-1 μm. This curable resin composition has characteristics such that the obtained dried coating film has good resolution, and there is minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Selected drawing] None