TWI846888B

A curable resin composition including at least one resin selected from the group consisting of polyimides and polyimide precursors having a polyalkyleneoxy group and a polymerizable group, a polymerization initiator, a polymerizable compound, and a solvent; a cured film obtained by curing the curabl...

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Bibliographische Detailangaben
1. Verfasser:	NOZAKI, ATSUYASU
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	A curable resin composition including at least one resin selected from the group consisting of polyimides and polyimide precursors having a polyalkyleneoxy group and a polymerizable group, a polymerization initiator, a polymerizable compound, and a solvent; a cured film obtained by curing the curable resin composition; a laminate including the cured film; a method for producing the cured film; a semiconductor device including the cured film or the laminate; and a polyimide or a polyimide precursor.