TWI846846B

A dry film 11 includes a curable resin layer 12 made of a light-shielding curable resin composition containing: a polymer resin having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or greater; a coloring agent; and an inorganic filler. When the thickness of...

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Hauptverfasser: ENDO, ARATA, NAKADA, KAZUTAKA
Format: Patent
Sprache:chi
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Zusammenfassung:A dry film 11 includes a curable resin layer 12 made of a light-shielding curable resin composition containing: a polymer resin having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or greater; a coloring agent; and an inorganic filler. When the thickness of the curable resin layer 12 is X (μm), the largest particle diameter of aggregate particles of the inorganic filler is X/2 (μm) or less. The dry film 11 has excellent light-shielding performance, and is configured such that warping is suppressed and burrs and chipping during dicing can also be suppressed.