Package carrier and manufacturing method thereof and chip package structure

A package carrier includes a first redistribution structure layer, a plurality of conductive connecting members, a connection structure layer, at least one stiffener and a molding compound. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and a plurality of pads. A top surface and a bottom surface of each of the pads are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface of the first redistribution structure layer and located at least between the conductive connecting members. The molding compound is disposed on the first surface of the first redistribution structure layer and covers the conducti