Laminated structure of an adhesive

Disclosed is a laminated structure of an adhesive, being suitable for making an under-screen biometric identification module. The laminated structure of the adhesive includes a first substrate, a touch metal layer, and a second substrate. The first substrate has an array of through holes. The touch...

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Bibliographische Detailangaben
1. Verfasser:	LI, BIAOBIAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CALCULATING CHEMISTRY COMPUTING COUNTING DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is a laminated structure of an adhesive, being suitable for making an under-screen biometric identification module. The laminated structure of the adhesive includes a first substrate, a touch metal layer, and a second substrate. The first substrate has an array of through holes. The touch metal layer is bonded to the first substrate through a first adhesive layer. The second substrate is bonded to the touch metal layer through a second adhesive layer. The through hole array passes through the touch metal layer so that a gas flow channel is formed between the touch metal layer and the first substrate, and between the touch metal layer and the second substrate. In doing so, the air bubbles generated by the biometric identification module under the screen after assembling is thus reduced.