TWI843003B
To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective depo...
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creator | TANAKA, KATSUYUKI NAGAO, TOSHIMITSU HASHIZUME, KEI KAWASAKI, KANA SETO, HIROKI |
description | To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective deposition, barrier properties, bondability, etc. A catalyst-imparting solution for electroless plating contains a cobalt compound and a reducing agent. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI843003BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI843003BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI843003BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MDE2MDB24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEABfYbZw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI843003B</title><source>esp@cenet</source><creator>TANAKA, KATSUYUKI ; NAGAO, TOSHIMITSU ; HASHIZUME, KEI ; KAWASAKI, KANA ; SETO, HIROKI</creator><creatorcontrib>TANAKA, KATSUYUKI ; NAGAO, TOSHIMITSU ; HASHIZUME, KEI ; KAWASAKI, KANA ; SETO, HIROKI</creatorcontrib><description>To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective deposition, barrier properties, bondability, etc. A catalyst-imparting solution for electroless plating contains a cobalt compound and a reducing agent.</description><language>chi</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240521&DB=EPODOC&CC=TW&NR=I843003B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240521&DB=EPODOC&CC=TW&NR=I843003B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANAKA, KATSUYUKI</creatorcontrib><creatorcontrib>NAGAO, TOSHIMITSU</creatorcontrib><creatorcontrib>HASHIZUME, KEI</creatorcontrib><creatorcontrib>KAWASAKI, KANA</creatorcontrib><creatorcontrib>SETO, HIROKI</creatorcontrib><title>TWI843003B</title><description>To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective deposition, barrier properties, bondability, etc. A catalyst-imparting solution for electroless plating contains a cobalt compound and a reducing agent.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDE2MDB24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEABfYbZw</recordid><startdate>20240521</startdate><enddate>20240521</enddate><creator>TANAKA, KATSUYUKI</creator><creator>NAGAO, TOSHIMITSU</creator><creator>HASHIZUME, KEI</creator><creator>KAWASAKI, KANA</creator><creator>SETO, HIROKI</creator><scope>EVB</scope></search><sort><creationdate>20240521</creationdate><title>TWI843003B</title><author>TANAKA, KATSUYUKI ; NAGAO, TOSHIMITSU ; HASHIZUME, KEI ; KAWASAKI, KANA ; SETO, HIROKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI843003BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA, KATSUYUKI</creatorcontrib><creatorcontrib>NAGAO, TOSHIMITSU</creatorcontrib><creatorcontrib>HASHIZUME, KEI</creatorcontrib><creatorcontrib>KAWASAKI, KANA</creatorcontrib><creatorcontrib>SETO, HIROKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA, KATSUYUKI</au><au>NAGAO, TOSHIMITSU</au><au>HASHIZUME, KEI</au><au>KAWASAKI, KANA</au><au>SETO, HIROKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI843003B</title><date>2024-05-21</date><risdate>2024</risdate><abstract>To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective deposition, barrier properties, bondability, etc. A catalyst-imparting solution for electroless plating contains a cobalt compound and a reducing agent.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | TWI843003B |
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