TWI843003B

To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective depo...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA, KATSUYUKI, NAGAO, TOSHIMITSU, HASHIZUME, KEI, KAWASAKI, KANA, SETO, HIROKI
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective deposition, barrier properties, bondability, etc. A catalyst-imparting solution for electroless plating contains a cobalt compound and a reducing agent.