TWI842918B

Provided is a composition that can be used to etch a metal layer, e.g. a copper layer, and that makes it possible to form a fine pattern that has excellent dimensional precision and little cross-sectional narrowing of fine lines while suppressing the generation of a residual film. A composition that...

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Bibliographische Detailangaben
Hauptverfasser:	ABE, TETSUJI, NOGUCHI, YUTA
Format:	Patent
Sprache:	chi
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	Provided is a composition that can be used to etch a metal layer, e.g. a copper layer, and that makes it possible to form a fine pattern that has excellent dimensional precision and little cross-sectional narrowing of fine lines while suppressing the generation of a residual film. A composition that is an aqueous solution that contains (A) 0.1-25 mass% of at least one type of component selected from the group that consists of cupric ions and ferric ions, (B) 0.1-30 mass% of chloride ions, (C) 0.01-10 mass% of a compound that is represented by general formula (1) and has a number average molecular weight of 350-1,200, (D) 0.01-10 mass% of at least one type of component selected from the group that consists of unsaturated carboxylic acids and salts and anhydrides thereof, and water.