Semiconductor package, manufacturing method of semiconductor package and thermoconductive composition used for the same

A semiconductor package of the present invention is provided with: a substrate; a semiconductor element provided on the substrate; and a heat spreader surrounding the periphery of the semiconductor element, wherein the semiconductor element and the heat spreader are bonded with a thermally conductiv...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAMOTO, MAKOTO, WATABE, NAOKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A semiconductor package of the present invention is provided with: a substrate; a semiconductor element provided on the substrate; and a heat spreader surrounding the periphery of the semiconductor element, wherein the semiconductor element and the heat spreader are bonded with a thermally conductive material having a particle connecting structure in which metal particles are formed through sintering by heat treatment.