TWI841657B

TWI841657B

To provide a laminate structure which achieves both excellent resolution and circuit concealment property while satisfying heat resistance and mechanical characteristics, a dry film, and an electronic component having its cured product as a permanent film, for example, a coverlay or a solder resist....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOIKE, NAOYUKI, MIYABE, HIDEKAZU
Format: Patent
Sprache:chi
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:To provide a laminate structure which achieves both excellent resolution and circuit concealment property while satisfying heat resistance and mechanical characteristics, a dry film, and an electronic component having its cured product as a permanent film, for example, a coverlay or a solder resist.SOLUTION: A laminate structure has a resin layer (A) and a resin layer (B) laminated on a base material through the resin layer (A), in which the resin layer (B) is formed of a photosensitive curable resin composition having L value of 20 to -40, a value of +10 to -10 and b value of +10 to -10 in a L*a*b* color system in a cured film having a film thickness of 5 μm of a single layer, and the resin layer (A) is formed of an alkali development type curable resin composition having L value of 35 or less, a value of +10 to -10 and b value of +10 to -10 in a L*a*b* color system in a cured film having a film thickness of 25 μm of a single layer.SELECTED DRAWING: None