TWI841340B

This non-photosensitive surface modifier is for forming a surface modification layer between a metal layer and a resin layer, and at least includes a heterocyclic compound having a structure of general formula (W) or general formula (Y), the heterocyclic compound being contained in a concentration o...

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Hauptverfasser: HARA, JUN, MIKOSHIBA, EMIKO
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MIKOSHIBA, EMIKO
description This non-photosensitive surface modifier is for forming a surface modification layer between a metal layer and a resin layer, and at least includes a heterocyclic compound having a structure of general formula (W) or general formula (Y), the heterocyclic compound being contained in a concentration of 0.001-0.01 mass%. [In the formulae, Rn1 and Rn2 each represent an alkyl group; L represents a linking group; W1 to W7 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and W1 to W7 form a fused ring together; Y1 to Y5 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and Y1 to Y5 form a fused ring together; and m is an integer of 1 or larger.]
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI841340BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI841340BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI841340BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MDE0NjFw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEABwgbbQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI841340B</title><source>esp@cenet</source><creator>HARA, JUN ; MIKOSHIBA, EMIKO</creator><creatorcontrib>HARA, JUN ; MIKOSHIBA, EMIKO</creatorcontrib><description>This non-photosensitive surface modifier is for forming a surface modification layer between a metal layer and a resin layer, and at least includes a heterocyclic compound having a structure of general formula (W) or general formula (Y), the heterocyclic compound being contained in a concentration of 0.001-0.01 mass%. [In the formulae, Rn1 and Rn2 each represent an alkyl group; L represents a linking group; W1 to W7 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and W1 to W7 form a fused ring together; Y1 to Y5 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and Y1 to Y5 form a fused ring together; and m is an integer of 1 or larger.]</description><language>chi</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CORRECTING FLUIDS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INKS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240501&amp;DB=EPODOC&amp;CC=TW&amp;NR=I841340B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240501&amp;DB=EPODOC&amp;CC=TW&amp;NR=I841340B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HARA, JUN</creatorcontrib><creatorcontrib>MIKOSHIBA, EMIKO</creatorcontrib><title>TWI841340B</title><description>This non-photosensitive surface modifier is for forming a surface modification layer between a metal layer and a resin layer, and at least includes a heterocyclic compound having a structure of general formula (W) or general formula (Y), the heterocyclic compound being contained in a concentration of 0.001-0.01 mass%. [In the formulae, Rn1 and Rn2 each represent an alkyl group; L represents a linking group; W1 to W7 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and W1 to W7 form a fused ring together; Y1 to Y5 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and Y1 to Y5 form a fused ring together; and m is an integer of 1 or larger.]</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CORRECTING FLUIDS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INKS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDE0NjFw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEABwgbbQ</recordid><startdate>20240501</startdate><enddate>20240501</enddate><creator>HARA, JUN</creator><creator>MIKOSHIBA, EMIKO</creator><scope>EVB</scope></search><sort><creationdate>20240501</creationdate><title>TWI841340B</title><author>HARA, JUN ; MIKOSHIBA, EMIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI841340BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CORRECTING FLUIDS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INKS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>HARA, JUN</creatorcontrib><creatorcontrib>MIKOSHIBA, EMIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HARA, JUN</au><au>MIKOSHIBA, EMIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI841340B</title><date>2024-05-01</date><risdate>2024</risdate><abstract>This non-photosensitive surface modifier is for forming a surface modification layer between a metal layer and a resin layer, and at least includes a heterocyclic compound having a structure of general formula (W) or general formula (Y), the heterocyclic compound being contained in a concentration of 0.001-0.01 mass%. [In the formulae, Rn1 and Rn2 each represent an alkyl group; L represents a linking group; W1 to W7 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and W1 to W7 form a fused ring together; Y1 to Y5 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and Y1 to Y5 form a fused ring together; and m is an integer of 1 or larger.]</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL PAINT OR INK REMOVERS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CORRECTING FLUIDS
DIFFUSION TREATMENT OF METALLIC MATERIAL
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
INKS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
PRINTED CIRCUITS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
USE OF MATERIALS THEREFOR
WOODSTAINS
title TWI841340B
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