Substrate and simecondutor device

Substrate and simecondutor device

A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region (10) for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad (401). The reversed-L-shaped pad (401) is disposed in proximity to an apex (A) of the corner of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANG, HUII, HO, SHAOUN, LIN, HSUAN-YI, HUANG, PU-SHAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region (10) for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad (401). The reversed-L-shaped pad (401) is disposed in proximity to an apex (A) of the corner of the surface mount region (10).