TWI838833B

The present invention relates to a protective film formation apparatus, which can form a protective film with a flat surface without a burden on a device. The protective film formation apparatus according to the present invention comprises: a resin supply unit (32) which supplies a curable liquid re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: NISHIGAKI, HISASHI
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:The present invention relates to a protective film formation apparatus, which can form a protective film with a flat surface without a burden on a device. The protective film formation apparatus according to the present invention comprises: a resin supply unit (32) which supplies a curable liquid resin (R) to the surface on which a device of a substrate is mounted; a substrate holding unit (33) which holds the substrate to which the curable resin (R) is supplied; a backup unit (34) which is provided to face the substrate holding unit (33); a tape supply unit (35) which supplies an anti-adhesion tape (T) between the substrate holding unit (33) and the backup unit (34); a pressing unit (36) which presses the substrate toward the backup unit (34) to bring the curable resin (R), supplied to the substrate, to be close to the anti-adhesion tape (T) and spread the curable resin (R) on the substrate; a curing unit (37) which cures the curable resin (R) spread on the substrate; and a curing unit (86) which is provided