Epoxy resin composition and cured product, prepreg, adhesive sheet, laminate thereof

Provided are a cured product and a non-halogenated flame-retardant epoxy resin composition capable of realizing high thermal conductivity and having excellent tracking resistance of 600 V or more on a circuit board. In particular, the epoxy resin composition comprises an epoxy resin, a curing agent,...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAKE, CHIKARA, MURAI, HIDEYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	Provided are a cured product and a non-halogenated flame-retardant epoxy resin composition capable of realizing high thermal conductivity and having excellent tracking resistance of 600 V or more on a circuit board. In particular, the epoxy resin composition comprises an epoxy resin, a curing agent, and a filler, wherein the epoxy resin is characterized by comprising: a novolac-type epoxy resin having a specific molecular weight distribution; and a phosphorus-containing epoxy resin obtained by reaction with a phosphorus compound represented by chemical formula (1). In the formula, R^1 and R^2 each independently represent a hydrocarbon group having 1-20 carbon atoms, optionally having a hetero atom, and may be a linear chain type, a branched chain type, or a ring type, wherein R^1 and R^2 may be joined to form a ring structure, and n1 and n2 are each independently 0 or 1.